Pcb assembly service manufacturer right now? Best Technology, establish on June 28, 2006, is a Hong Kong registered company whom focused on one-stop solution provider of FPC, Rigid-flex, MCPCB, FR4 PCB, Ceramic PCB, Special PCB such as Heavy Copper (up to 20 OZ), extra thin PCB (0.10, 0.15mm), and PCB assembly service. Discover more information on best pcb assembly service. Art-of-state Technology: Most of our engineer and operators has more than ten years of experience in PCB industry, so we can produce special such as 20 OZ heavy copper board, 4 layer MCPCB, etc.
Best Through Hole Technology assemble more than 50 kinds components Factory Price. We offer a complete range of through hole PCB assembly capabilities in compliance with IPC quality standards. We provide Through Hole Technology (THT) PCBA service at the highest quality level and in a cost-effective manner. Our through hole technology (THT) PCB Assembly services includes both manual and automated techniques. While our manual soldering techniques can handle complex assemblies, the automated ones are best suited for high volume production as well as reduced material handling. We provide THT PCBA service at the highest quality level and in a cost-effective manner.
Tg means Glass Transition Temperature. As flammability of printed circuit board (PCB) is V-0 (UL 94-V0), so if the temperature exceeds designated Tg value, the board will changed from glassy state to rubbery state and then the function of PCB will be affected. If working temperature of your product is higher than normal (130-140C), then have to use High Tg PCB material which is > 170C. and popular PCB high value are 170C, 175C, and 180C. Normally the FR4 circuit board Tg value should be at least 10-20C higher than working temperature of product. If you 130TG board, working temperature will be lower than 110C; if use 170 high TG board, then maximum working temperature should be lower than 150C.
According to different manufacturing method, current there’re three basic types for ceramic board: A) Thick Film Ceramic Board Thick Film Ceramic PCB: Using this technology, the thickness of conductor layer exceeds 10 micron, more thick than spurting technology. The conductor is silver or gold palladium, and was printed on ceramic substrate. More for Thick Film Ceramic PCB. B) DCB Ceramic Board DCB (Direct Copper Bonded) technology denotes a special process in which the copper foil and the core (Al2O3 or ALN), on one or both sides, are directly bonded under appropriate high temperature and pressure. See even more information on https://www.bstpcb.com/.
The main difference between a FR4 board and MCPCB is the thermal conductivity dielectric material in the MCPCB. This acts as a thermal bridge between the IC components and metal backing plate. Heat is conducted from the package through the metal core to an additional heat sink. On the FR4 board the heat remains stagnant if not transferred by a topical heatsink. According to lab testing a MCPCB with a 1W LED remained near an ambient of 25C, while the same 1W LED on a FR4 board reached 12C over ambient. LED PCB always be produced with Aluminum core, but sometimes steel core PCB also be used.